Enhancing the Structural Characteristics of Copper Oxide Films by Plasma Technique

Abstract

In this paper X-ray diffraction examinations showed the appearance of three different phases, Cu, and the crystallization size was 47.99, 48.77, and 30.17 for the CCuITO sample (10, 20, 30), respectively.

As for the density of dislocations, it decreased from the first sample from 4.43 x 1014 lin/m2 to 4.21 x 1014 lin/m2, while the third sample was 1.1 x 1015 lin/m2. As for the mesh stress, it had the same behavior as the density of dislocations, as for the first and second samples it decreased from 0.0028 to 0.0027, while It increased for the third sample to reach 0.0044 The results of the AFM images showed that the average grain size distribution on the surface was 0.119, 0.117, and 0.125 micrometers for the three samples, respectively, while the roughness increased for the first and second samples from 53.55 to 87.771 nanometers, but it increased slightly for the third sample to reach 67.003 nanometers. SEM image results showed that the grain size increased with increasing plasma treatment time, rising from 82.2 to 105 nm with an increase in agglomerations.